This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Samsung Electro-Mechanics Co., Ltd.. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Hyo Bin Park: Innovator in Solder Resist Technology
Introduction: Hyo Bin Park is a notable inventor based in Yeongi-gun, Korea. He has made significant contributions to the field of electronics by inventing a novel method for forming solder resist, a critical aspect in the packaging of electronic components. His work not only showcases his innovative spirit but also exemplifies the importance of advancing technology in the electronics sector.
Latest Patents: Hyo Bin Park holds a patent for a "Method for forming solder resist and substrate for package." This invention involves a comprehensive process for forming a solder resist, which is essential for the assembly of electronic packages. The method includes several steps: firstly, it entails forming a first solder resist inner region through coating, exposing, and developing a solder resist on a substrate featuring both outer PoP pads and inner chip pads. The outer portion of the solder resist on the outer region of the substrate is then removed, followed by curing the inner portion. Additionally, a plugged SR region is established, which protects the substrate. The process also involves changing the surface roughness through a desmear process and ultimately forming a second solder resist SMD region.
Career Highlights: Hyo Bin Park currently works at Samsung Electro-Mechanics Co., Ltd., where he applies his expertise in electronic materials and technologies. His role here has allowed him to focus on innovation in substrate technology, directly impacting the efficiency and effectiveness of electronic devices.
Collaborations: Throughout his career, Hyo Bin Park has collaborated with esteemed colleagues, including Chang Bo Lee and Chang Sup Ryu. Their teamwork has fostered an environment of creativity and technical advancement within the research and development sector at Samsung.
Conclusion: Hyo Bin Park's contributions to the field of solder resist technology signify his important role as an innovator at Samsung Electro-Mechanics Co., Ltd. His patent reflects a commitment to enhancing electronic packaging methods, ensuring that the industry continues to move forward with reliable and efficient technologies. As he continues to collaborate with talented individuals, the future looks promising for further advancements in this domain.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile