This inventor holds 1 USPTO granted patent. Top assignee: Haesung Ds Co., Ltd.. Active years: 2020.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2020
Title: Hyeok Jin Jeon: Innovator in Semiconductor Packaging
Introduction
Hyeok Jin Jeon is a notable inventor based in Changwon-si, South Korea. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative methods and techniques.
Latest Patents
Hyeok Jin Jeon holds a patent for a "Method for manufacturing semiconductor package substrate." This method involves several steps, including forming a trench in a conductive base substrate, filling it with resin, and curing the resin to create a durable semiconductor package. His innovative approach enhances the efficiency and reliability of semiconductor packaging.
Career Highlights
Hyeok Jin Jeon is currently employed at Haesung DS Co., Ltd., where he continues to develop and refine technologies in semiconductor manufacturing. His work has positioned him as a key player in the industry, contributing to advancements that benefit various applications.
Collaborations
Hyeok Jin Jeon collaborates with In Seob Bae, a talented female engineer, to further enhance their projects and drive innovation within their company.
Conclusion
Hyeok Jin Jeon's contributions to semiconductor packaging through his patented methods demonstrate his commitment to innovation and excellence in the field. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile