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Changwon-si, South Korea

Haesung Ds Co., Ltd.

USPTO Granted Patents = 38

Trademarks = 2

Forward Citations = 78

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42 inventors (with patents filed for the assignee):

In Seob Bae (13 out of 13 patents)

Jin Woo Lee (10 out of 66 patents)

Sung Il Kang (9 out of 9 patents)

4. Jae Hoon Jang (4 out of 13 patents)

5. Ho Sang Yu (4 out of 4 patents)

6. Jong Hoe Ku (3 out of 3 patents)

7. Jea Won Kim (3 out of 3 patents)

8. Dong Jin Yoon (3 out of 3 patents)

9. Jong Woo Kim (3 out of 74 patents)

10. Byung Moon Lee (3 out of 3 patents)

11. Jin Kee Hong (3 out of 5 patents)

12. Dong Kwan Won (2 out of 2 patents)

13. Sang-min Lee (2 out of 3 patents)

14. Dong-Il Shin (2 out of 4 patents)

15. Se-Chuel Park (2 out of 5 patents)

38 patents: Sort by Forward Citations

1. 12457694 - Multilayer circuit board manufacturing apparatus and multilayer circuit board manufacturing method (2025-10-28),

2. 12341086 - Lead frame (2025-06-24),

3. 12327728 - Method for manufacturing a pre-mold substrate (2025-06-10),

4. 12308899 - Composite coil pattern for wireless charging and magnetic secure transmission (2025-05-20),

5. 12249571 - Pre-mold substrate and method of manufacturing pre-mold substrate (2025-03-11),

6. 12104964 - Sensor package and sensor package module including the same (2024-10-01),

7. 12041731 - Multilayer circuit board manufacturing apparatus (2024-07-16),

8. 11876012 - Method of manufacturing semiconductor package substrate and semiconductor package substrate manufactured using the same (2024-01-16),

9. 11854830 - Method of manufacturing circuit board (2023-12-26),

10. 11674890 - Saw based optical sensor device and package including the same (2023-06-13),

11. 11227775 - Method of fabricating carrier for wafer level package by using lead frame (2022-01-18),

12. 11209323 - Sensor package with reduced height cavity walls and sensor package module including the same (2021-12-28),

13. 11139220 - Flexible semiconductor package formed by roll-to-roll process (2021-10-05),

14. 11112352 - Saw based optical sensor device and package including the same (2021-09-07),

15. 10942070 - Sensor unit, temperature sensor including the same, method of manufacturing the sensor unit, and method of manufacturing the temperature sensor (2021-03-09),

HAESUNG DS CO., LTD. is a leading manufacturer and supplier of electronic components and modules. With over 20 years of experience in the industry, the company specializes in providing high-quality products that cater to various sectors including automotive, consumer electronics, and industrial applications. HAESUNG DS focuses on delivering innovative solutions, fostering strong customer relationships, and maintaining consistent product quality. Through continuous research and development, the company remains at the forefront of technological advancements and strives to meet the evolving needs of its global clientele.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

38 Patents

#6 in Changwon-si

#368 in South Korea

#17,287 in the World

Changwon-si, South Korea

Haesung Ds Co., Ltd.

Forward Citations = 78

42 inventors:

In Seob Bae (13 out of 13 patents)

Jin Woo Lee (10 out of 66 patents)

Sung Il Kang (9 out of 9 patents)

4. Jae Hoon Jang (4 out of 13 patents)

5. Ho Sang Yu (4 out of 4 patents)

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