The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 26, 2023
Filed:
Sep. 14, 2020
Applicant:
Haesung Ds Co., Ltd., Changwon-si, KR;
Inventors:
Assignee:
HAESUNG DS CO., LTD., Changwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/498 (2006.01); C25D 5/02 (2006.01); G03F 7/16 (2006.01); G03F 7/42 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4828 (2013.01); C25D 5/022 (2013.01); G03F 7/164 (2013.01); G03F 7/422 (2013.01); H01L 21/4839 (2013.01); H01L 23/49582 (2013.01); H01L 23/49861 (2013.01);
Abstract
A method of manufacturing a circuit board includes preparing a substrate having electrical conductivity, removing a portion of a first surface of the substrate to form a plurality of pillars on the first surface of the substrate, locating an insulating material on the first surface of the substrate to cover a space between the plurality of pillars of the substrate, forming a pattern on a second surface, which is opposite to the first surface of the substrate, by removing a portion of the second surface of the substrate, forming a first metal layer on the first surface of the substrate, and forming a second metal layer on the second surface of the substrate.