This inventor holds 1 USPTO granted patent. Top assignee: Opnext Japan, Inc.. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Hura Harpreet Singh: Semiconductor Polishing Invention.
Introduction
Hura Harpreet Singh is an inventor associated with Yokohama, Japan. Her work includes an invention addressing damage to semiconductor substrates during polishing.
Latest Patents
Singh is credited with 1 patent: “Polishing Method for Semiconductor Substrate, and Polishing Jig Used Therein.” The invention describes a fixing jig with one or more grooves on the substrate-facing surface, sized approximately to match the semiconductor substrate’s diameter. The jig is intended to help suppress outer-surface damage and cracking that can occur when a thinned, weakened wafer is polished.
Career Highlights
Singh is associated with Opnext Japan, Inc. Her patent focuses on a practical challenge in semiconductor manufacturing: protecting wafers whose strength has been reduced through polishing.
Collaborations
Kenji Uchida and Ryu Washino are identified as Singh’s coworkers.
Conclusion
Hura Harpreet Singh’s semiconductor polishing invention presents a jig-based approach to reducing substrate damage and cracking during wafer processing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile