The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Jan. 04, 2005
Ryu Washino, Chigasaki, JP;
Yasushi Sakuma, Tokyo, JP;
Masaru Mukaikubo, Fujisawa, JP;
Hura Harpreet Singh, Yokohama, JP;
Kenji Uchida, Yokohama, JP;
Ryu Washino, Chigasaki, JP;
Yasushi Sakuma, Tokyo, JP;
Masaru Mukaikubo, Fujisawa, JP;
Hura Harpreet Singh, Yokohama, JP;
Kenji Uchida, Yokohama, JP;
OpNext Japan, Inc., Yokohama-shi, JP;
Abstract
During the polishing of a semiconductor substrate, the semiconductor wafer that has been reduced in thickness, and hence in strength, by polishing, suffers outer-surface damage (or cracking) due to the initial damage caused by the use of polishing quartz. In order to solve these problems, the present invention applies a semiconductor substrate fixing jig formed with, on the face for fixing the semiconductor substrate, a groove(s) of almost the same diameter as that of the semiconductor substrate. Semiconductor substrate damage and cracking can be suppressed by applying this jig.