This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: National Chung Shan Institute of Science and Technology. Active years: 2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2015
Title: Innovations by Inventor Hung-Tai Ku
Introduction
Hung-Tai Ku is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of integrated circuit technology. His innovative approach has led to the development of a unique method for producing three-dimensional integrated circuit structures.
Latest Patents
Hung-Tai Ku holds a patent for a "Method for producing three-dimensional integrated circuit structure." This invention includes a first metal circuit substrate, an interposer substrate that is electrically connected to the first metal circuit substrate, and at least one semiconductor component placed on the interposer substrate. The interposer substrate is designed to dissipate heat generated by the operation of the semiconductor components, thereby increasing their lifespan. He has 1 patent to his name.
Career Highlights
Hung-Tai Ku is affiliated with the National Chung Shan Institute of Science and Technology, where he continues to work on advancing technology in integrated circuits. His research and development efforts have positioned him as a key figure in his field.
Collaborations
Some of his notable coworkers include Yang-Kuo Kuo and Chia-Yi Hsiang, who have collaborated with him on various projects.
Conclusion
Hung-Tai Ku's innovative work in three-dimensional integrated circuit structures showcases his commitment to enhancing technology and improving the performance of semiconductor components. His contributions are valuable to the ongoing advancements in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile