Taipei, Taiwan

Hung-Hsiang Yeh

This inventor holds 1 USPTO granted patent. Top assignee: Tong Hsing Electronic Industries, Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hung-Hsiang Yeh. Retrieved from https://idiyas.com/inventor/hung-hsiang-yeh-h1mo82tq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Hung-Hsiang Yeh

Introduction

Hung-Hsiang Yeh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging structures for transistors. His innovative approach has led to the creation of a unique wireless transistor outline package structure.

Latest Patents

Hung-Hsiang Yeh holds 1 patent for his invention titled "Wireless Transistor Outline Package Structure." This patent describes a wireless transistor outline (TO) package structure that includes a carrying module, a chip, and a lead frame both mounted on the carrying module. A sheet-like bonding module is mounted on the chip and the lead frame in a flip chip manner, along with an encapsulant that covers the components. The design features a connection pad of the chip and a connection segment of the lead frame that are coplanar with each other. The bonding module consists of a ceramic substrate and multiple circuit layers that are stacked and formed in a direct plated copper (DPC) manner. The areas of the circuit layers decrease in size as they move away from the ceramic substrate, while their thicknesses increase in the same direction. The outermost circuit layer connects the connection pad and the connection segment to establish an electrical connection.

Career Highlights

Hung-Hsiang Yeh is currently employed at Tong Hsing Electronic Industries, Ltd., where he continues to innovate and contribute to the field of electronic packaging. His work has been instrumental in advancing the technology used in wireless communication devices.

Collaborations

Hung-Hsiang Yeh collaborates with Jia-Yi Wu, a fellow professional in the industry. Their combined expertise enhances the development of innovative solutions in electronic packaging.

Conclusion

Hung-Hsiang Yeh's contributions to the field of electronics, particularly through his patented wireless transistor outline package structure, demonstrate his commitment to innovation. His work at Tong Hsing Electronic Industries, Ltd. continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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