Hung-Ho Lee

Title: Innovations of Inventor Hung-Ho Lee

Introduction

Hung-Ho Lee is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His work focuses on enhancing the functionality and performance of electronic components through innovative design and fabrication methods.

Latest Patents

Among his latest patents is a method for fabricating an electronic package. This electronic package includes an encapsulation layer embedded with a first electronic component and conductive pillars. A circuit structure is disposed on one surface of the encapsulation layer, while a second electronic component is placed on the circuit structure. An insulation layer is formed on the other surface of the encapsulation layer, and a circuit portion is disposed on the insulation layer. The unique arrangement of the first and second electronic components on two sides of the circuit structure allows the electronic package to achieve various functions and high performance.

Career Highlights

Hung-Ho Lee is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing electronic packaging technologies. His innovative approaches have led to the development of high-performance electronic packages that meet the demands of modern technology.

Collaborations

He has collaborated with notable coworkers, including Kong-Toon Ng and Chee-Key Chung. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

Hung-Ho Lee's contributions to electronic packaging through his patents and collaborations highlight his role as a significant inventor in the field. His innovative methods continue to influence the industry and pave the way for future advancements.