Siliconware Precision Industries Co., Ltd.

Hung-Ho Lee

Chang-Fu Lin

Chee-Key Chung

Chi-Hsin Chiu

Kong-Toon Ng

An electronic package is provided, including: an encapsulation layer embedded with a first electronic component and conductive pillars; a circuit structure disposed on one surface of the encapsulation layer; a second electronic component disposed on the circuit structure; an insulation layer formed on the other surface of the encapsulation layer; and a circuit portion disposed on the insulation layer. Since the first and second electronic components are disposed on two sides of the circuit structure, respectively, the electronic package has various functions and high performance. A method for fabricating the electronic package is also provided.

Growing community of inventors

Taichung, Taiwan

Hung-Ho Lee