Hung En Hsu

Title: Innovations by Inventor Hung En Hsu

Introduction

Hung En Hsu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on improving the accuracy of via measurements in device components.

Latest Patents

Hung En Hsu holds 1 patent related to his innovative methods and pad structures for testing via accuracy. The patent describes a method that includes forming a first pad and a second pad on a device component. The second pad features a via landing area and a clearance opening. The process involves providing a core substrate with a cavity, placing the device component within that cavity, and forming a build-up film over both the device component and the core substrate. Additionally, it includes forming a first contact via that extends through the build-up film to contact the landing area, as well as a second contact via that extends through the build-up film and the clearance opening. A continuity test is then performed to determine if the second contact via is in contact with the second pad.

Career Highlights

Hung En Hsu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work there has been instrumental in advancing the technology used in semiconductor manufacturing.

Collaborations

Hung has collaborated with various professionals in his field, including his coworker Wei-Hsuen Lee. Their joint efforts have contributed to the development of innovative solutions in semiconductor technology.

Conclusion

Hung En Hsu is a prominent inventor whose work in via accuracy measurement has the potential to enhance semiconductor manufacturing processes. His contributions are valuable to the industry and reflect his dedication to innovation.