Company Filing History:
Years Active: 2002
Title: Innovations by Inventor Hung Dao
Introduction
Hung Dao is a notable inventor based in San Jose, California. He has made significant contributions to the field of substrate support assemblies, particularly in the area of thermal expansion compensation. His innovative work is recognized within the industry, showcasing his expertise and dedication to advancing technology.
Latest Patents
Hung Dao holds a patent for a "Support assembly with thermal expansion compensation." This invention features a substrate support and a collar that may include at least one slit. The slit is designed to allow for thermal expansion compensation within the support assembly. Additionally, the collar serves to protect the dielectric from erosion in a process chamber. In one version of the invention, the collar incorporates a clamping ring on the dielectric, enhancing its functionality and durability.
Career Highlights
Hung Dao is currently employed at Applied Materials, Inc., a leading company in the semiconductor and display industries. His work at Applied Materials has allowed him to apply his innovative ideas and contribute to the development of advanced technologies. His patent reflects his commitment to improving processes and equipment used in various applications.
Collaborations
Hung Dao has collaborated with esteemed colleagues, including Gerhard M Schneider and Hamid Noorbakhsh. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Hung Dao's contributions to the field of substrate support assemblies demonstrate his innovative spirit and technical expertise. His patent for thermal expansion compensation highlights the importance of addressing challenges in technology. Through his work at Applied Materials, he continues to make a significant impact in the industry.