This inventor holds 1 USPTO granted patent. Top assignee: Walsin Advanced Electronics Ltd.. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: Innovations of Hung Chia-Yu in Multi-board BGA Packaging
Introduction
Hung Chia-Yu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging technologies. His innovative approach has led to the creation of a unique multi-board BGA package that addresses critical challenges in electronic design.
Latest Patents
Hung Chia-Yu holds a patent for a multi-board BGA package. This invention comprises a chip, a plurality of circuit boards, metal bonding wires, solder balls, and a package body. The design features circuit boards formed on the same plane, with a galley between adjacent boards that allows for the passage of metal bonding wires. This configuration connects the chip with the circuit board and facilitates the molding of the package body. The multi-board structure effectively holds the chip, reducing thermal stress caused by CTE mismatch.
Career Highlights
Hung Chia-Yu is currently employed at Walsin Advanced Electronics Ltd., where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the capabilities of BGA technology, making it more efficient and reliable for various applications.
Collaborations
Hung collaborates with talented coworkers, including Su Chun-Jen and Lai Chien-Hung. Their combined expertise contributes to the success of their projects and the advancement of technology at Walsin Advanced Electronics Ltd.
Conclusion
Hung Chia-Yu's contributions to the field of electronics, particularly through his patent for the multi-board BGA package, showcase his innovative spirit and dedication to improving technology. His work not only enhances product performance but also sets a foundation for future advancements in electronic packaging.