Taipei, Taiwan

Hung-cheng Liao

This inventor holds 1 USPTO granted patent and 5 published patent applications. Top assignees: Foxconn (Kunshan) Computer Connector Co., Ltd., Foxconn Interconnect Technology Limited. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hung-cheng Liao. Retrieved from https://idiyas.com/inventor/hung-cheng-liao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovations of Hung-cheng Liao

Introduction

Hung-cheng Liao is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electrical connectors, particularly focusing on enhancing signal transmission through innovative designs. His work exemplifies the intersection of technology and practical application in modern electronics.

Latest Patents

One of Hung-cheng Liao's key patents is an electrical connector with a grounding plate module designed for higher signal transmission. This invention includes a longitudinal insulating housing, multiple differential-pair signal terminals, and grounding terminals arranged longitudinally. The grounding plate module, which is retained within the insulating housing, features an electromagnetic interference (EMI) absorber and a grounding plate. The grounding plate is equipped with several grounding fingers that extend out of the EMI absorber to make contact with corresponding grounding terminals. This design aims to improve the performance and reliability of electrical connections.

Career Highlights

Hung-cheng Liao has worked with prominent companies in the electronics industry, including Foxconn Computer Connector Co., Ltd. and Foxconn Interconnect Technology Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in connector technology.

Collaborations

Throughout his career, Hung-cheng Liao has collaborated with talented individuals such as Shih-wei Hsiao and Genn-sheng Lee. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hung-cheng Liao's contributions to the field of electrical connectors highlight his innovative spirit and dedication to improving technology. His patent for an electrical connector with a grounding plate module showcases his ability to address complex challenges in signal transmission. Through his work and collaborations, he continues to influence the electronics industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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