This inventor holds 1 USPTO granted patent. Top assignee: Walsin Advanced Electronics Ltd.. Active years: 2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2001
Title: Hui-Ping Liu: Innovator in Semiconductor Technology
Introduction
Hui-Ping Liu is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique lead frame structure that enhances semiconductor packaging.
Latest Patents
Hui-Ping Liu holds 1 patent for his invention titled "Lead frame structure." This patent describes a lead frame designed for a semiconductor package. The lead frame features a die pad and a plurality of leads. One surface of the die pad supports a silicon chip, while the other surface contains a series of annular grooves, all sharing the same geometric center. The inner lead portion of the leads surrounds the die pad, with the die pad and the leads positioned on different planar surfaces.
Career Highlights
Hui-Ping Liu is currently employed at Walsin Advanced Electronics Ltd. His role at the company allows him to apply his expertise in semiconductor technology. His contributions have been instrumental in advancing the company's product offerings.
Collaborations
Hui-Ping Liu has collaborated with talented coworkers, including Wen-Chun Liu and Yi-Hsiang Pan. Their teamwork has fostered an environment of innovation and creativity within the company.
Conclusion
Hui-Ping Liu's work in semiconductor technology exemplifies the spirit of innovation. His patent for the lead frame structure showcases his commitment to advancing the field. His contributions continue to impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile