Hui-Peng Wang

Title: Hui-Peng Wang: Innovator in Wafer Bumping Technology

Introduction

Hui-Peng Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer bumping technology. His innovative approach has led to the development of a patented method that enhances the readability of wafer identification characters.

Latest Patents

Hui-Peng Wang holds a patent for a method to make wafer laser marks visible after the bumping process. This patent outlines a wafer bumping method that includes several steps. A wafer with fields is provided, which contains at least one wafer identification character. A dry film resist is formed over the wafer, and portions of this resist are selectively exposed using a mask. The mask is shifted to ensure that the fields containing the wafer identification character are double exposed. After developing the selectively exposed dry film resist, solder is plated over the wafer to form solder bumps. This process ensures that the wafer identification character remains readable by optical character recognition.

Career Highlights

Hui-Peng Wang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work focuses on improving manufacturing processes and enhancing product quality through innovative techniques.

Collaborations

Hui-Peng Wang has collaborated with notable colleagues such as Charles Tseng and Hwei-Mei Yu. Their combined expertise contributes to advancements in semiconductor technology and innovation.

Conclusion

Hui-Peng Wang's contributions to wafer bumping technology exemplify the importance of innovation in the semiconductor industry. His patented methods not only improve manufacturing processes but also ensure the reliability of wafer identification.