Hui-Ling Chung

Title: Hui-Ling Chung: Innovator in Circuit Board Technology

Introduction

Hui-Ling Chung is a notable inventor based in Taipei Hsien, Taiwan. He has made significant contributions to the field of circuit board technology. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of circuit boards.

Latest Patents

Hui-Ling Chung holds a patent for a "Circuit board and manufacturing method thereof." This invention comprises a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts, and a fixing element. The first conductive layer is formed on the substrate, while the through hole is created on both the substrate and the first conductive layer. The protection layer, which includes several hollow portions, surrounds the through hole, exposing the first conductive layer within these hollow areas. The contacts are positioned in the hollow portions, protruding from the surface of the protection layer. The fixing element is secured in the through hole, establishing contact with the contacts. This innovative design improves the overall performance of circuit boards.

Career Highlights

Hui-Ling Chung is associated with Giga-Byte Technology Co., Ltd., a prominent company in the technology sector. His work at Giga-Byte has allowed him to collaborate with other talented professionals in the field.

Collaborations

Some of his coworkers include Yung-Shun Kao and Yu-Chiang Lu, who contribute to the innovative environment at Giga-Byte Technology Co., Ltd.

Conclusion

Hui-Ling Chung's contributions to circuit board technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving electronic components.