The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2011

Filed:

May. 19, 2008
Applicants:

Yung-shun Kao, Taipei Hsien, TW;

Hui-ling Chung, Taipei Hsien, TW;

Yu-chiang LU, Taipei Hsien, TW;

Chung-wei Chiang, Taipei Hsien, TW;

Inventors:

Yung-Shun Kao, Taipei Hsien, TW;

Hui-Ling Chung, Taipei Hsien, TW;

Yu-Chiang Lu, Taipei Hsien, TW;

Chung-Wei Chiang, Taipei Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/02 (2006.01); H05K 7/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A circuit board is provided, comprising a substrate, a first conductive layer, at least one through hole, a protection layer, a plurality of contacts and a fixing element. The first conductive layer is formed on the substrate. The through hole is formed on the substrate and the first conductive layer. The protection layer is formed on the first conductive layer, wherein the protection layer comprises a plurality of hollow portions, the hollow portions surround the through hole, and the first conductive layer is exposed in the hollow portions. The contacts are disposed in the hollow portions, wherein the contacts are protruding from a surface of the protection layer. The fixing element is fixed in the through hole, wherein the fixing element contacts the contacts.


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