This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Hui-Jing Chang in Electronic Packaging
Introduction
Hui-Jing Chang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, particularly through his innovative patent. His work focuses on enhancing the performance and reliability of electronic devices.
Latest Patents
Hui-Jing Chang holds a patent for an "Electronic package and manufacturing method thereof." This invention involves a unique design where a cover is placed on a carrier structure containing an electronic element. A magnetic conductive member is strategically positioned between the cover and the electronic element, creating an air gap that improves the shielding effect of the electronic package. This innovation is crucial for protecting sensitive electronic components from external interference.
Career Highlights
Hui-Jing Chang is currently employed at Siliconware Precision Industries, Ltd., a leading company in the semiconductor packaging industry. His role involves research and development, where he applies his expertise to create advanced packaging solutions that meet the demands of modern electronics.
Collaborations
Hui-Jing Chang collaborates with talented colleagues, including Wen-Jung Tsai and Chih-Hsien Chiu. Together, they work on various projects that aim to push the boundaries of electronic packaging technology.
Conclusion
Hui-Jing Chang's contributions to electronic packaging through his innovative patent demonstrate his commitment to advancing technology in this field. His work not only enhances the performance of electronic devices but also showcases the importance of collaboration in driving innovation.