This inventor holds 2 USPTO granted patents. Top assignee: Foxconn Technology Co., Ltd.. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: Hui-Fu Lee: Innovator in Heat Pipe Technology
Introduction
Hui-Fu Lee is a notable inventor based in Tu-Cheng, Taiwan. He has made significant contributions to the field of heat pipe technology, holding a total of 2 patents. His work focuses on enhancing the performance and efficiency of heat pipes, which are essential components in various thermal management applications.
Latest Patents
Hui-Fu Lee's latest patents include a performance testing apparatus for heat pipes. This innovative apparatus features an immovable portion with a cooling structure designed to cool the heat pipe under test. A movable portion is capable of moving relative to the immovable portion, also equipped with a cooling structure. The design includes a receiving structure positioned between the immovable and movable portions to securely hold the heat pipe. Additionally, a concavo-convex cooperating structure is integrated to prevent misalignment during testing, ensuring precise reception of the heat pipe. Temperature sensors are strategically placed on both portions to monitor the heat pipe's temperature accurately.
Career Highlights
Hui-Fu Lee is currently employed at Foxconn Technology Co., Ltd., a leading technology company known for its manufacturing capabilities. His role at Foxconn allows him to apply his innovative ideas in a practical setting, contributing to advancements in thermal management solutions.
Collaborations
Hui-Fu Lee has collaborated with notable coworkers such as Tay-Jian Liu and Chao-Nien Tung. Their combined expertise fosters a creative environment that enhances the development of cutting-edge technologies.
Conclusion
Hui-Fu Lee's contributions to heat pipe technology exemplify his dedication to innovation and excellence. His patents reflect a commitment to improving thermal management systems, making a significant impact in the industry.