Hsinchu, Taiwan

Hui-Feng Chen


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Innovations of Hui-Feng Chen

Introduction

Hui-Feng Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of chemical-mechanical polishing, particularly through his innovative patent.

Latest Patents

Hui-Feng Chen holds a patent for a CMP polishing pad having an edge exclusion region of an offset concentric groove pattern. This invention provides a polishing pad and a method for using the pad to chemically-mechanically polish a substrate. The polishing pad features at least a grooved region and an exclusion region, which is located adjacent to the circumference of the pad and devoid of grooves. This design enhances the efficiency and effectiveness of the polishing process.

Career Highlights

Hui-Feng Chen is currently employed at Cabot Microelectronics Corporation, a leading company in the field of advanced materials. His work focuses on developing innovative solutions that improve the performance of semiconductor manufacturing processes.

Collaborations

Hui-Feng Chen has collaborated with several talented individuals in his field, including Ching-Ming Tsai and Shi-Wei Cheng. These collaborations have contributed to the advancement of technologies in chemical-mechanical polishing.

Conclusion

Hui-Feng Chen's contributions to the field of polishing technology through his patent and work at Cabot Microelectronics Corporation highlight his role as an influential inventor. His innovative approaches continue to shape the industry and improve manufacturing processes.

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