Hui-Chun Chiang

Title: Innovations by Hui-Chun Chiang in Semiconductor Packaging Technology

Introduction

Hui-Chun Chiang, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor packaging. With a total of five patents to his name, he stands out as a respected figure at Taiwan Semiconductor Manufacturing Company Ltd. His innovative approaches and technical expertise have greatly advanced semiconductor technology.

Latest Patents

One of Hui-Chun Chiang's recent patents focuses on a method of fabricating semiconductor packages. This innovative design includes a first semiconductor die and a second semiconductor die, incorporating a first insulating encapsulation, a dielectric layer structure, and a conductor structure. The first semiconductor die is designed with a first semiconductor substrate and a through substrate via (TSV) that extends from one side to the other. The encapsulation of the first semiconductor die is achieved through the first insulating layer, while the second semiconductor die is positioned atop the first semiconductor substrate. Notably, the patent outlines that a terminal of the TSV is coplanar with the surface of the first insulating encapsulation, thus enhancing the overall functionality of the semiconductor package.

Career Highlights

Hui-Chun Chiang has dedicated his career to advancing semiconductor technology, demonstrating a profound understanding of fabrication processes. His innovative methods have not only contributed to the efficiency of semiconductor packaging but have also facilitated improved performance in various electronic applications. His work is recognized among peers and has garnered attention for its practicality and effectiveness in modern semiconductor design.

Collaborations

Throughout his career, Hui-Chun Chiang has collaborated with notable coworkers such as Hao-Yi Tsai and Cheng-Chieh Hsieh. These partnerships have fostered a dynamic environment for innovation, allowing for the exchange of ideas that have led to further advancements in semiconductor packaging technology.

Conclusion

Hui-Chun Chiang's contributions to semiconductor packaging research reflect his commitment to innovation and excellence in the field. His patents offer valuable insights that not only support the advancement of technology but also set a foundation for future developments in semiconductor design. As the industry continues to evolve, the impact of Hui-Chun's work is likely to resonate, paving the way for new horizons in semiconductor applications.