Hockessin, DE, United States of America

Huey-Ming Wang


Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 101(Granted Patents)


Location History:

  • Wilmington, DE (US) (1997)
  • Hockessin, DE (US) (1998 - 1999)

Company Filing History:


Years Active: 1997-1999

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3 patents (USPTO):Explore Patents

Title: The Innovative Mind of Huey-Ming Wang in Hockessin, DE

Introduction

Huey-Ming Wang is a noteworthy inventor based in Hockessin, Delaware, recognized for his contributions to the field of polishing techniques in semiconductor manufacturing. He holds three patents, showcasing his innovative approach to enhancing the efficiency and effectiveness of polishing composites.

Latest Patents

His most recent patents include significant advancements in the methods used for polishing materials that comprise a combination of insulators and metals. The first patent details a method for polishing a composite that includes an insulating layer, metal, and titanium. This method involves polishing the composite in a standard polishing machine using an aqueous slurry that contains submicron abrasive particles, iodate, and peroxide. Interestingly, peroxide is introduced to the slurry only when polishing a titanium or titanium nitride layer. Additionally, the invention incorporates the addition of a base to modify the pH of the used slurry, stabilizing it at around 7 or higher.

The second patent introduces a composition and method directed specifically at polishing composites containing titanium. These aqueous slurries include water, submicron abrasive particles, an oxidizing agent, and a phenolic compound with polar substituents. Furthermore, these slurries can also be formulated to maintain the integrity of substrates comprising tungsten, aluminum, or copper, making his work particularly versatile.

Career Highlights

Huey-Ming Wang is associated with Rodel Inc., a company that focuses on delivering advanced materials and solutions for the semiconductor industry. Throughout his career, he has continually contributed to advancements in production processes, particularly in improving polishing methodologies that enhance substrate quality.

Collaborations

Wang has collaborated with fellow experts in the field, including Lee Melbourne Cook and Anantha R Sethuraman. These partnerships have played a significant role in the development of innovative processes and products that cater to the growing needs of semiconductor manufacturing.

Conclusion

Huey-Ming Wang’s work exemplifies the spirit of innovation, driving advancements in the semiconductor industry through his patented techniques. As technology continues to evolve, his contributions will undoubtedly influence future developments in polishing methods and materials.

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