The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 1997

Filed:

Oct. 10, 1995
Applicant:
Inventors:

Jiun-Fang Wang, Hockessin, DE (US);

Anantha Sethuraman, Wilmington, DE (US);

Huey-Ming Wang, Wilmington, DE (US);

Lee Melbourne Cook, Steelville, PA (US);

Assignee:

Rodel, Inc., Newark, DE (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ; C23F / ;
U.S. Cl.
CPC ...
216 88 ; 216 89 ; 216100 ; 216102 ; 216105 ; 252 791 ; 51309 ;
Abstract

An aqueous slurry is provided for polishing or planarizing a work piece which contains a metal, the solids portion of said slurry being comprised of 1 to 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from the group consisting of aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.


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