Rodel Inc.

Huey-Ming Wang

Lee Melbourne Cook

Anantha R Sethuraman

Guangwei Wu

Jiun-Fang Wang

A process is provided for polishing a composite comprised of an insulating layer, a metal and titanium in which the composite is polished in a standard polishing machine using an aqueous slurry comprising submicron abrasive particles, an iodate, and a peroxide. Another process is provided in which peroxide is added to the aqueous slurry only when a titanium or titanium nitride layer is being polished. Further the invention also comprises the addition of a base to the slurry stream exiting the polishing machine to bring the pH of the used slurry to about 7 or higher.

Method for polishing a composite comprising an insulator, a metal, and

Aqueous slurries are provided, which are useful for the chemical-mechanical polishing of substrates comprising titanium, comprising: water, submicron abrasive particles, an oxidizing agent, and a mono-, di-, or tri-substituted phenol wherein at least one of the substituted functional groups is polar. Optionally the compositions may also comprise a compound to suppress the rate of removal of silica. The slurries are useful on substrates which also comprise tungsten, aluminum or copper.

Composition and method for polishing a composite comprising titanium

An aqueous slurry is provided for polishing or planarizing a work piece which contains a metal, the solids portion of said slurry being comprised of 1 to 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from the group consisting of aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.

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Hockessin, DE, United States of America

Huey-Ming Wang