Huck Khim Koay

Title: Huck Khim Koay: Innovator in Encapsulation and Light Source Technologies

Introduction

Huck Khim Koay is a notable inventor based in Penang, Malaysia. He has made significant contributions to the fields of encapsulation and light source technologies. With a total of 3 patents to his name, Koay has demonstrated his expertise and innovative spirit in various applications.

Latest Patents

One of his latest patents is titled "Encapsulating brittle substrates using transfer molding." This invention features a transfer molding arrangement designed to encapsulate a substrate with an encapsulating material. The arrangement includes a bottom mold and a top mold, with a space provided between them for receiving the substrate. When a sufficient clamping force is applied, the molds abut against each other, effectively distributing the force exerted on the substrate. Another significant patent is for a "Light source," which is suitable for surface mounting onto a printed circuit board. This light source comprises a planar substrate with a centrally positioned recess, where a light-emitting diode is mounted. The substrate is encapsulated by a transparent encapsulant material, forming an ellipsoidal dome over the diode.

Career Highlights

Throughout his career, Huck Khim Koay has worked with prominent companies such as Agilent Technologies, Inc. and Avago Technologies General IP (Singapore) Pte. Ltd. His experience in these organizations has contributed to his development as an inventor and innovator in his field.

Collaborations

Koay has collaborated with talented individuals, including Cheng Why Tan and Seong Choon Lim. These partnerships have likely enriched his work and led to further advancements in technology.

Conclusion

Huck Khim Koay is a distinguished inventor whose work in encapsulation and light source technologies has made a significant impact. His innovative patents and collaborations reflect his commitment to advancing technology in meaningful ways.