Agilent Technologies, Inc.

Avago Technologies General IP (singapore) Pte. Ltd.

Huck Khim Koay

Cheng Why Tan

Chee Keong Chong

Seong Choon Lim

Gurbir Singh

Sundar A/l Natarajan Yoganandan

Beng Huat Low

Sundar A L Natarajan Yoganandan

Gurbir Singh A/l Balwant Singh

A transfer molding arrangement for encapsulating a substrate with an encapsulating material comprising a bottom mold and a top mold, wherein a space is provided between the top mold and bottom mold for receiving the substrate, and the top mold and/or the bottom mold is/are arranged in such a way that when a clamping force is applied sufficiently strong, the top mold and bottom mold are abutted against each other, thereby distributing the force exerted on the substrate to the top mold and bottom mold.

Encapsulating brittle substrates using transfer molding

A light source suitable for surface mounting onto a printed circuit board. The light source includes a planar substrate with a centrally positioned recess. A light emitting diode is mounted in the recess and the substrate is encapsulated by a transparent encapsulant material forming an ellipsoidal dome over the light emitting diode.

Light source

A method of interconnecting bond pads on a semiconductor die to leads of a package is disclosed. The method includes placing a connector over each bond pad and its corresponding lead. The connector is one of a plurality of ganged connectors. The method also includes electrically connecting the connector to the bond pad and the lead and singularizing the connector from the plurality of ganged connectors. Such a method of interconnection has the advantage of simultaneously interconnecting multiple bond pads to leads. In a preferred embodiment, light-emitting diodes (LEDs) are manufactured using the method. A PCB is etched to produced lead pairs of the LEDs. A semiconductor die is attached to a first lead of each lead pair. Ganged interconnects are aligned with and tagged onto the dies and the second leads of the lead pairs, thereby electrically connecting them. After tagging, the interconnects are singularized. An encapsulant is applied on each die and interconnect. Each die, interconnect and lead pair are then separated to form individual LEDs.

Method of interconnecting an electronic device

Growing community of inventors

Penang, Malaysia

Huck Khim Koay