Huang-Chuan Chang

Title: Innovations by Huang-Chuan Chang in Electronic Components

Introduction

Huang-Chuan Chang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic components, particularly in the development of lead-free bump processes. His innovative approach addresses the challenges associated with traditional soldering methods, promoting environmentally friendly practices in electronics manufacturing.

Latest Patents

Huang-Chuan Chang holds a patent for a process titled "Process for forming lead-free bump on electronic component." This patent outlines a method that includes preparing an electronic component with at least one bond pad and a passivation layer. The process involves forming an under bump metallurgy (UBM) structure, applying a photoresist, and depositing a thick copper layer through electroplating. The method ensures that copper ions diffuse into the solder material without raising the reflow temperature profile, thus preventing damage to the photoresist.

Career Highlights

Throughout his career, Huang-Chuan Chang has worked with prominent companies such as Siliconware Precision Industries Co., Ltd. and China Steel Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic component manufacturing.

Collaborations

Huang-Chuan Chang has collaborated with talented individuals in his field, including Chun-Sheng Ho and Feng-Lung Chien. These partnerships have fostered innovation and the sharing of ideas, further enhancing the development of new technologies.

Conclusion

Huang-Chuan Chang's work in the field of electronic components exemplifies the importance of innovation in technology. His patented process for forming lead-free bumps represents a significant step towards more sustainable manufacturing practices.