Company Filing History:
Years Active: 2015-2017
Title: Hualiang Shi: Innovator in Semiconductor Technology
Introduction
Hualiang Shi is a prominent inventor based in Chandler, AZ (US), known for his contributions to semiconductor technology. With a total of 2 patents, he has made significant advancements in the field, particularly in mitigating contamination and addressing die warpage in microelectronics.
Latest Patents
Hualiang Shi's latest patents include innovative solutions for semiconductor substrates. One patent focuses on structures designed to mitigate contamination on the back side of a semiconductor substrate. This invention involves a microelectronics device that features a substrate with integrated circuitry on the front side, where vias extend to the back side. The redistribution layer on the back side includes a ring structure and raised structures that enhance adhesion for dicing tape. Another patent addresses die warpage during 3D die-to-die stacking. This method involves forming a contact pad array on an integrated circuit substrate, ensuring that the accessible areas of the contact pads differ, which aids in the deposition of solder.
Career Highlights
Hualiang Shi is currently employed at Intel Corporation, a leading company in the semiconductor industry. His work at Intel has allowed him to develop and refine his innovative ideas, contributing to the advancement of microelectronics.
Collaborations
Hualiang has collaborated with notable coworkers such as Shengquan Ou and Sairam Agraharam, further enhancing the innovative environment at Intel Corporation.
Conclusion
Hualiang Shi's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and excellence in the field. His work continues to influence the development of advanced microelectronics, showcasing the importance of creativity in technology.