The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Jun. 28, 2013
Hualiang Shi, Chandler, AZ (US);
Shengquan E. Ou, Chandler, AZ (US);
Sairam Agraharam, Chandler, AZ (US);
Tyler N. Osborn, Gilbert, AZ (US);
Hualiang Shi, Chandler, AZ (US);
Shengquan E. Ou, Chandler, AZ (US);
Sairam Agraharam, Chandler, AZ (US);
Tyler N. Osborn, Gilbert, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A method including forming a contact pad array on an integrated circuit substrate, the contact pad array including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads; and depositing solder on the accessible area of the contact pads. An apparatus including an integrated circuit substrate including a body having a nonplanar shape and a surface including a first plurality of contact pads and a second plurality of contact pads, wherein an accessible area of each of the first plurality of contact pads is different than an accessible area of each of the second plurality of contact pads.