Hua-Ping Chen

Title: Innovations of Hua-Ping Chen in Fingerprint Sensor Technology

Introduction

Hua-Ping Chen is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of fingerprint sensor technology. His innovative work has led to the development of a unique sliding type thin fingerprint sensor package.

Latest Patents

Hua-Ping Chen holds 1 patent for his invention titled "Sliding type thin fingerprint sensor package." This patent describes a sliding type thin fingerprint sensor package that includes a substrate, a fingerprint sensor chip, and a metal plate. The fingerprint sensor chip is electrically connected to the substrate, with a sensing region exposed through a window in the dielectric layer. The metal plate is also connected to the substrate, and its sliding surface is positioned close to the sensing region of the fingerprint sensor chip. Both the sensing region and the sliding surface are accessible through the window of the dielectric layer, allowing for efficient functionality.

Career Highlights

Hua-Ping Chen is associated with Chipbond Technology Corporation, where he continues to innovate in the field of sensor technology. His work has been instrumental in advancing the capabilities of fingerprint sensors, making them more efficient and user-friendly.

Collaborations

Hua-Ping Chen has collaborated with notable colleagues, including Yeh-Shun Chen and Lin-Hsin Chen. Their combined expertise has contributed to the success of various projects within the company.

Conclusion

Hua-Ping Chen's contributions to fingerprint sensor technology exemplify the spirit of innovation. His patent for the sliding type thin fingerprint sensor package showcases his commitment to advancing technology in this field. His work continues to influence the development of more efficient and effective fingerprint sensing solutions.