Hu-Hai Zhang

Title: Innovations of Hu-Hai Zhang in PCB Manufacturing

Introduction

Hu-Hai Zhang is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of printed circuit board (PCB) manufacturing. With a total of 2 patents, his work focuses on innovative methods that enhance the efficiency and precision of PCB production.

Latest Patents

Hu-Hai Zhang's latest patents include a method for manufacturing multilayer printed circuit boards. This method involves providing a first and second PCB substrate along with an adhesive layer. The process includes forming an opening in the adhesive layer, filling it with a mass, and laminating the substrates together. The alignment of the imaginary boundaries is misaligned to achieve better results. Another patent he holds is a method of cutting PCBs using a laser. This method ensures high positioning precision and improved cutting results by applying a laser beam to an exposed area of the PCB module.

Career Highlights

Throughout his career, Hu-Hai Zhang has worked with reputable companies such as Fukui Precision Component (Shenzhen) Co., Ltd. and Zhen Ding Technology Co., Ltd. His experience in these organizations has contributed to his expertise in PCB technology and innovation.

Collaborations

Hu-Hai Zhang has collaborated with talented individuals in the industry, including Ying Su and Cheng-Hsien Lin. These collaborations have likely fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Hu-Hai Zhang's contributions to PCB manufacturing through his innovative patents and career experiences highlight his role as a significant inventor in the field. His work continues to influence the industry and pave the way for future advancements.