Hsun Yu

Title: Hsun Yu - Innovator in Chip Stacking Technology

Introduction

Hsun Yu is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of chip stacking structures. His innovative work has led to the development of a patented technology that enhances the efficiency and performance of electronic devices.

Latest Patents

Hsun Yu holds a patent for a chip stacking structure that includes a plurality of microbump structures, first substrates, at least one first space layer, second substrates, and at least one second space layer. This invention allows for the stacking of first substrates using microbump structures, with each substrate featuring at least one redistribution layer. The design incorporates space layers between the stacked substrates, which contribute to the formation of impedance elements that provide a specific oscillation frequency. This technology is crucial for advancing the capabilities of modern electronic devices.

Career Highlights

Hsun Yu is affiliated with the Industrial Technology Research Institute, where he has been instrumental in driving research and development in semiconductor technologies. His work has not only resulted in patents but has also contributed to the advancement of industry standards in chip design and manufacturing.

Collaborations

Hsun Yu has collaborated with notable colleagues, including Chang-Chih Liu and Peng-Shu Chen, who share his commitment to innovation in technology. Their combined expertise has fostered a collaborative environment that encourages the development of cutting-edge solutions in the semiconductor field.

Conclusion

Hsun Yu's contributions to chip stacking technology exemplify the spirit of innovation that drives the semiconductor industry forward. His patented work and collaborations highlight the importance of teamwork in achieving technological advancements.