This inventor holds 3 USPTO granted patents. Top assignee: Industrial Technology Research Institute. Active years: 2002-2003.
Location History:
- Taipei, TW (2002 - 2003)
- Hsinchu, TW (2003)
Company Filing History:
Years Active: 2002-2003
Title: Hsuan Peng: Innovator in Electromagnetic Mold Clamping Technology
Introduction
Hsuan Peng is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of mold clamping technology, particularly through his innovative use of electromagnetic mechanisms. With a total of 3 patents to his name, Peng continues to push the boundaries of engineering and manufacturing.
Latest Patents
Hsuan Peng's latest patents include a "Method and device for clamping electromagnetically molds of injection molding machine." This device features a stand with a fixed board and a guiding mechanism, allowing a movable board to slide back and forth. The design facilitates mold opening, closing, and locking actions through a magnetic force generating mechanism. Another significant patent is the "Linkage type mold clamping device driven by electromagnetic force." This invention utilizes magnetic force to drive a movable plate, enabling efficient open-mold, close-mold, and mold-locking movements.
Career Highlights
Hsuan Peng is currently employed at the Industrial Technology Research Institute, where he applies his expertise in developing advanced manufacturing technologies. His work has been instrumental in enhancing the efficiency and effectiveness of injection molding processes.
Collaborations
Hsuan Peng collaborates with talented individuals such as Min-Wen Wang and Ming-Chang Deng, contributing to a dynamic and innovative work environment.
Conclusion
Hsuan Peng's contributions to electromagnetic mold clamping technology exemplify his commitment to innovation in manufacturing. His patents reflect a deep understanding of engineering principles and a drive to improve industrial processes.