The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2003

Filed:

May. 07, 2001
Applicant:
Inventors:

Min-Wen Wang, Taipei Hsien, TW;

Liteh Hu, Taipei, TW;

Hsin Hung Lin, Taichung, TW;

Hsuan Peng, Taipei, TW;

Ming-Chang Deng, Hsin Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 4/564 ;
U.S. Cl.
CPC ...
B29C 4/564 ;
Abstract

A device for clamping electromagnetically molds of the injection molding machine comprises a stand on which a fixed board and a guiding mechanism are mounted. A movable board is slidably mounted on the guiding mechanism to slide back and forth in relation to the fixed board. The fixed board is provided with a male mold mounted thereon. The movable board is provided with a female mold mounted thereon. The sliding motion of the movable board toward the fixed board brings about the mold opening action, the mold closing action, and the mold locking action. The movable board and the fixed board are provided with a magnetic force generating mechanism for effecting attraction or repulsion between the movable board and the fixed board. The attraction serves to effect the mold closing action and the mold locking action. The repulsion serves to effect the mold opening action.


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