This inventor holds 1 USPTO granted patent and 9 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hsuan-Jen Wang and an Innovation in Electronic Packaging.
Introduction
Hsuan-Jen Wang is an inventor associated with Taichung, Taiwan. Her patent work includes an electronic package design intended to support improved antenna signal transmission.
Latest Patents
Wang is credited with 1 patent: “Electronic Package and Manufacturing Method Thereof.” The invention places an electronic element on a carrier structure and stacks an antenna structure above it using conductors. An insulating support body is formed between the structures, while a through hole in the antenna remains unfilled and contains air. By using air’s dielectric constant, the design aims to reduce signal loss and signal offset, helping facilitate antenna signal transmission.
Career Highlights
Wang is associated with Siliconware Precision Industries, Ltd. Her patent describes an approach to electronic packaging that integrates an antenna structure with a carrier and uses an air-filled opening as part of its signal-performance design.
Collaborations
Wang’s listed coworkers include Yi-Chun Lai and Rung-Jeng Lin.
Conclusion
Hsuan-Jen Wang’s patent presents an electronic packaging innovation that uses an air-filled antenna through hole to help reduce signal loss and offset.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile