Hsu Yu-Nu

Title: Hsu Yu-Nu: Innovating MEMS Device Encapsulation

Introduction

Hsu Yu-Nu is a pioneering inventor based in Pittsburgh, PA, known for his significant contribution to the field of microelectromechanical systems (MEMS). He holds a patent that addresses the encapsulation of MEMS devices, enhancing their durability and performance. This invention is a testament to Hsu's innovative spirit and commitment to advancing technology.

Latest Patents

Hsu Yu-Nu's patent, titled "Encapsulation of MEMS devices using pillar-supported caps," represents a key innovation in MEMS technology. The patent outlines a process for fabricating MEMS microstructures within a sealed cavity, where etchant entry holes are created as a by-product of the fabrication process. This method eliminates the need for additional steps to etch holes in the cap layer, thereby streamlining production. The process involves extending layers of sacrificial material beyond the cap layer's horizontal boundaries. It relies on pillars formed by deposition in holes etched through the sacrificial layers, leading to the formation of etchant entry holes as the excess material is removed, creating voids between the supporting pillars.

Career Highlights

Currently, Hsu Yu-Nu works at Ic Mechanics, Inc., a company dedicated to mechanical innovation. His role involves utilizing his expertise in MEMS technology to drive research and development initiatives. His patent reflects not only his technical skills but also his forward-thinking approach in addressing challenges within the industry.

Collaborations

During his career, Hsu has collaborated with notable colleagues including L Richard Carley and Suresh Santhanam. These partnerships have allowed for a fruitful exchange of ideas and fostered a collaborative environment aimed at pushing the boundaries of MEMS technology.

Conclusion

Hsu Yu-Nu's contributions to the field of MEMS devices showcase the impact of innovation in advancing technology. His patent for the encapsulation process demonstrates a significant step forward in the efficient fabrication of robust MEMS microstructures. As he continues his work at Ic Mechanics, Inc., the industry looks forward to witnessing further advancements from this talented inventor.