Hsu-Tien Hu

Title: **Hsu-Tien Hu: Innovator in Semiconductor Technology**

Introduction

Hsu-Tien Hu, a prominent inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of three patents to his name, Hu's innovations focus on enhancing the manufacturing processes of flip chips and wafer level packages.

Latest Patents

One of Hu's latest patents is the "Method for forming solder bumps on flip chips and devices formed". This invention introduces a dual-photoresist method to create fine-pitched solder bumps on flip chips. By utilizing two separate layers of photoresist, this method allows for a more accurate imaging process, minimizing common issues linked to thicker photoresist layers. Additionally, an optional thin layer of non-leachable metal, such as copper or nickel, can be employed to enhance the electrical characteristics of the solder bumps.

Another noteworthy patent by Hu is the "Wafer level package incorporating elastomeric pads in dummy plugs". This invention describes a method of constructing a wafer level package by placing insulating pads made from elastic material under dummy plugs. The process helps mitigate cracking when solder balls are bonded, by providing stress relief, while also preventing contact between an elastomeric layer and polyimide passivation layer, which could lead to defects.

Career Highlights

Hsu-Tien Hu works at the Industrial Technology Research Institute, where he has been at the forefront of developing innovative solutions in semiconductor technology. His research and inventions have had a profound impact on the efficiency and reliability of semiconductor manufacturing.

Collaborations

Throughout his career, Hu has collaborated with notable colleagues such as Szu-Wei Lu and Ling-Chen Kung. Together, they have contributed to advancing the field, fostering a spirit of innovation and teamwork that underscores the collaborative nature of research and development in technology.

Conclusion

Hsu-Tien Hu's work in the semiconductor industry exemplifies the power of innovation in addressing technical challenges. His inventive solutions not only enhance manufacturing processes but also pave the way for future advancements in technology. With a commitment to excellence and collaboration, Hu continues to influence the trajectory of semiconductor research and development.