Hsinchu, Taiwan

Hsiu-Chu Chou

This inventor holds 1 USPTO granted patent. Top assignee: Silicon Integrated Systems Corporation. Active years: 2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsiu-Chu Chou. Retrieved from https://idiyas.com/inventor/hsiu-chu-chou

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2006

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1 patent (USPTO):Explore Patents

Title: Hsiu-Chu Chou: Innovator in Load Board Technology

Introduction

Hsiu-Chu Chou is a prominent inventor based in Hsinchu, Taiwan. She has made significant contributions to the field of integrated circuit testing. Her innovative approach has led to the development of a unique load board that enhances the efficiency of packaged IC testing.

Latest Patents

Hsiu-Chu Chou holds 1 patent for her invention titled "Load board - A load board for packaged IC testing." This load board features a predetermined testing circuit and bonding pad areas on its surface. A plurality of bonding pads is formed on these areas, each corresponding to a lead of a packaged IC for testing connection. This design allows for direct connection of the leads during IC testing, eliminating the need for a conventional test socket.

Career Highlights

Hsiu-Chu Chou is currently employed at Silicon Integrated Systems Corporation, where she continues to innovate in the field of semiconductor technology. Her work has been instrumental in advancing testing methodologies for integrated circuits.

Collaborations

Some of her notable coworkers include Ching-Jung Huang and Mu-Sheng Liao, who contribute to the collaborative environment at Silicon Integrated Systems Corporation.

Conclusion

Hsiu-Chu Chou's contributions to load board technology exemplify her innovative spirit and dedication to improving integrated circuit testing. Her work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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