This inventor holds 1 USPTO granted patent. Top assignee: Xintec Corporation. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: Hsin-Yen Lin: Innovator in Chip Packaging Technology
Introduction
Hsin-Yen Lin is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of chip packaging technology. His innovative approach has led to the development of a unique chip package that enhances the functionality and protection of sensor devices.
Latest Patents
Hsin-Yen Lin holds 1 patent for his invention titled "Chip package and method for forming the same." This patent describes a chip package that includes a substrate with an upper surface, a lower surface, and a sidewall surface. The substrate houses a sensor device adjacent to its upper surface. Additionally, the chip package features a light-shielding layer that surrounds the sensor device, providing enhanced protection. A cover plate is placed over the upper surface of the substrate, with a spacer layer positioned between the substrate and the cover plate. The patent also outlines a method for forming this innovative chip package.
Career Highlights
Hsin-Yen Lin is associated with Xintec Corporation, where he has been instrumental in advancing chip packaging technologies. His work has contributed to the company's reputation as a leader in the semiconductor industry. Lin's expertise in this area has positioned him as a key figure in the development of innovative solutions for electronic devices.
Collaborations
Hsin-Yen Lin has collaborated with talented individuals such as Yen-Shih Ho and Po-Han Lee. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Hsin-Yen Lin's contributions to chip packaging technology exemplify the spirit of innovation. His patent for a unique chip package demonstrates his commitment to enhancing the functionality and protection of sensor devices. Through his work at Xintec Corporation and collaborations with fellow inventors, Lin continues to make a significant impact in the field of semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile