Hsin-Pei Hsieh

Title: Hsin-Pei Hsieh: Innovator in High-Density Sensor Technology

Introduction

Hsin-Pei Hsieh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of sensor technology, holding a total of 3 patents. His innovative designs focus on enhancing the density and resolution of sensor modules, which are crucial for various applications.

Latest Patents

Hsieh's latest patents include a high-density sensor module that features a two-layer structure. This design incorporates a first substrate with multiple first sensors and conductive rods, all covered by a package resin member. The second substrate is positioned on top, further increasing the number of sensors and enhancing the sensing density and resolution. Another patent describes a high-density sensor module with a printed circuit board and a first supporting member. This module includes a sensing channel that allows for improved pressure sensitivity, thereby enhancing the overall performance of the sensors.

Career Highlights

Throughout his career, Hsin-Pei Hsieh has worked with prominent companies such as Hon Hai Precision Industry Co., Ltd. and Scienbizip Consulting (Shenzhen) Co., Ltd. His experience in these organizations has contributed to his expertise in sensor technology and innovation.

Collaborations

Hsieh has collaborated with several professionals in his field, including Jen-Tsorng Chang and Tsung-Ju Wu. These collaborations have likely played a role in the development of his innovative sensor technologies.

Conclusion

Hsin-Pei Hsieh is a distinguished inventor whose work in high-density sensor technology has made a significant impact. His patents reflect a commitment to advancing sensor capabilities, and his collaborations further enhance his contributions to the field.