Hon Hai Precision Industry Co., Ltd.

Scienbizip Consulting(shenzhen)co., Ltd.

Hsin-Pei Hsieh

Jen-Tsorng Chang

Yi-Cheng Lin

Tsung-Ju Wu

Fu-Hsin Chiu

A high density sensor module includes a first substrate, a plurality of first sensors positioned on the first substrate, a plurality of first conductive rods positioned on the corresponding first sensors, a first package resin member covering the first sensors and one end of each of the first conductive rods, a second substrate positioned on the first package resin member, a plurality of second sensors positioned on the second substrate, and a second package resin member covering the second sensors and another end of each of the first conductive rods. The first conductive rods pass through the first package resin member and the second substrate. The high density sensor module has a two-layer structure to increase the number of the sensors such that the sensing density and resolution of the high-density sensor module are increased.

High density sensor module

A high-density sensor module includes a substrate with a printed circuit board, a first supporting member disposed on a upper surface of the printed circuit board, the first supporting member includes at least one first sensing channel with a first right sidewall, at least one sensor disposed on the first right sidewall and electrically connected to the printed circuit board, and at least one first conductive unit arranged in the first sensing channel. The angle between the first right sidewall and the upper surface of the printed circuit board is not less than 90&#xb0;. When the first conductive unit is subjected to a pressure from outsides, the first conductive unit slides along a direction toward the upper surface of the printed circuit board and presses the sensors, and the pressure is conductive from the first conductive unit to the sensor. The sensing density and sensing resolution are enhanced.

A wireless location device comprises a BLUETOOTH beacon configured to emit wireless signals and an electromagnetic shielding cover. The BLUETOOTH beacon is positioned within the electromagnetic shielding cover. The electromagnetic shielding cover comprises an inner surface comprising a plurality of micro-structures, and an opening below the inner surface. The inner surface is configured to reflect towards the opening the wireless signals emitted by the BLUETOOTH beacon which are not directly emitted out of the opening.

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Taipei, Taiwan

Hsin-Pei Hsieh