Hsin-Lung Chun

Title: Hsin-Lung Chun: Electronic Packaging Innovation

Introduction

Hsin-Lung Chun is an inventor associated with Taichung, Taiwan, and Siliconware Precision Industries Co., Ltd. His patent work includes an electronic packaging design intended to support miniaturization while accommodating multiple electronic elements.

Latest Patents

The provided information identifies one patent associated with Chun: Electronic Package and Fabrication Method Thereof. The invention describes a substrate with electronic elements mounted on both its first and second surfaces. Separate encapsulants protect the elements, while a frame is also disposed on the substrate’s second surface. This arrangement allows the package to accommodate the required number of electronic elements without increasing the substrate’s surface area or the package’s overall volume. The patent also describes a method for fabricating the package. Chun is credited with 1 patent in the information provided.

Career Highlights

Chun’s listed work is connected to Siliconware Precision Industries Co., Ltd., a company involved in semiconductor packaging. The electronic package invention addresses the engineering challenge of fitting more components into a compact package.

Collaborations

The provided information lists Chi-Liang Shih and Chun-Chong Chien as Chun’s coworkers. It does not specify whether they collaborated with him on this patent.

Conclusion

Hsin-Lung Chun’s documented patent focuses on arranging electronic elements on both sides of a substrate to support compact packaging without increasing the package’s footprint or volume.