This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Mediatek Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hsin-Long Chen and His QFN Hybrid Package Invention.
Introduction
Hsin-Long Chen is an inventor based in Hsinchu, Taiwan. His patent record includes 1 patent, assigned to MediaTek Corporation.
Latest Patents
Chen’s patent, “Multi-die QFN hybrid package,” describes a package designed to combine flip-chip and wire-bonding connections. A carrier has flip-chip leads and wire-bonding leads, with a first and second die mounted separately on the flip-chip leads. A third die is stacked over both dies and connected to the surrounding wire-bonding leads by bond wires. A mold cap encapsulates the dies and bond wires while leaving the leads exposed on the package’s bottom surface.
Career Highlights
The available information identifies Chen as an inventor associated with MediaTek Corporation and documents his work on multi-die packaging technology. The patent’s design integrates multiple dies and two types of electrical connections within a single QFN package.
Collaborations
Chen’s patent is associated with MediaTek Corporation. The available details do not specify additional collaborators.
Conclusion
Hsin-Long Chen’s documented invention combines flip-chip mounting, stacked dies, and wire bonding in a compact QFN hybrid package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile