The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 2026
Filed:
May. 23, 2023
Mediatek Inc., Hsin-Chu, TW;
Hsin-Long Chen, Hsinchu City, TW;
Chin-Chiang Chang, Hsinchu City, TW;
MEDIATEK INC., Hsinchu City, TW;
Abstract
A multi-die QFN hybrid package includes a carrier having flip-chip leads and wire-bonding leads. A first die and a second die are mounted on the flip-chip leads, respectively, in a flip-chip manner. The first die is spaced apart from the second die. A third die is stacked over the first die and the second die. The third die is electrically connected to the wire-bonding leads around the first die and the second die through bond wires. A mold cap encapsulates the first die, the second die, the third die, the bond wires, and partially encapsulates the carrier. The flip-chip leads and the wire-bonding leads are exposed from a bottom mold cap surface.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile