Chin-Chiang Chang

Title: The Innovations of Chin-Chiang Chang: Pioneering Advances at Mediatek Corporation

Introduction: Chin-Chiang Chang, an accomplished inventor based in Kaohsiung, Taiwan, has made significant contributions to the field of electronic device technology. With a total of six patents to his name, Chang has been at the forefront of developing innovative solutions that enhance the performance and reliability of semiconductor packages.

Latest Patents: Among his notable inventions, Chang's latest patents include a "Three-dimensional pad structure and interconnection structure for electronic devices." This invention features a substrate with a pad that includes a solder mask perimeter and conductive pillars protruding from its top surface. Another significant patent is the "Semiconductor package with improved board level reliability," which describes a semiconductor package design that incorporates a die attach pad and lead terminals, ensuring better encapsulation and reliability for semiconductor devices.

Career Highlights: Chin-Chiang Chang currently works at Mediatek Corporation, a leading semiconductor company known for its innovations in wireless communications and consumer electronics. His work in developing advanced electronic interconnects has positioned him as a significant contributor within the electrical engineering domain.

Collaborations: Chang collaborates with several esteemed colleagues, including Long-Kun Yu and Chia-Wei Chi, who share his passion for technology and innovation. Their collective expertise aims to advance semiconductor technology and enhance product reliability in the industry.

Conclusion: Through his innovative work and dedication, Chin-Chiang Chang continues to influence the electronics sector significantly. His inventions not only advance technology but also contribute to the ever-evolving landscape of semiconductor packaging. As Mediatek Corporation continues to thrive, Chang's contributions will undoubtedly play a pivotal role in shaping future innovations.