The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2017

Filed:

May. 20, 2015
Applicant:

Mediatek Inc., Hsin-Chu, TW;

Inventors:

Long-Kun Yu, New Taipei, TW;

Chin-Chiang Chang, Kaohsiung, TW;

Chia-Wei Chi, Taipei, TW;

Chia-Feng Yeh, New Taipei, TW;

Tai-Yu Chen, Taipei, TW;

Assignee:

MEDIATEK INC., Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02J 7/04 (2006.01); H02J 7/16 (2006.01); H01L 35/32 (2006.01); H01L 23/498 (2006.01); H01L 35/28 (2006.01); H01L 21/66 (2006.01); H01L 23/04 (2006.01); H01L 23/12 (2006.01); H01L 23/20 (2006.01); H01L 23/00 (2006.01); H01L 25/04 (2014.01); H02J 7/00 (2006.01); H01L 23/38 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 22/34 (2013.01); H01L 23/04 (2013.01); H01L 23/12 (2013.01); H01L 23/20 (2013.01); H01L 23/49811 (2013.01); H01L 24/17 (2013.01); H01L 25/04 (2013.01); H01L 35/28 (2013.01); H02J 7/0052 (2013.01); H01L 23/38 (2013.01); H01L 23/49827 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1703 (2013.01); H01L 2224/17051 (2013.01); H01L 2224/17107 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01);
Abstract

The invention provides a portable electronic system. The portable electronic system includes a semiconductor package. The semiconductor package includes a substrate. A semiconductor die is coupled to the substrate. A thermoelectric device chip is disposed close to the semiconductor die, coupled to the substrate. The thermoelectric device chip is configured to detect a heat energy generated from the semiconductor die and to convert the heat energy into a recycled electrical energy. A power system is coupled to the semiconductor package, configured to store the recycled electrical energy.


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