Hsin Kuan

Title: Innovations of Hsin Kuan in Chip Packaging Technology.

Introduction

Hsin Kuan is a notable inventor based in Zhubei, Taiwan, recognized for his contributions to chip packaging technology. With a total of five patents to his name, he has made significant advancements in the field, particularly in the design and manufacturing methods of chip packages.

Latest Patents

Hsin Kuan's latest patents include innovative designs for chip packages. One of his patents describes a chip package that consists of a chip structure, a molding material, a conductive layer, a redistribution layer, and a passivation layer. The chip structure features a front surface, a rear surface, a sidewall, a sensing area, and a conductive pad. The molding material envelops the rear surface and the sidewall, while the conductive layer extends from the conductive pad to the molding material on the sidewall. The redistribution layer connects the molding material on the rear surface to that on the sidewall, ensuring electrical contact with the conductive layer. Additionally, the passivation layer is positioned on both the molding material and the redistribution layer, featuring an opening that accommodates a portion of the redistribution layer.

Another patent focuses on a chip package that includes a sensing chip, a computing chip, and a protective layer that surrounds both chips. The sensing chip is equipped with a first conductive pad and a sensing element, while the computing chip has a second conductive pad and a computing element. The protective layer is designed to expose the sensing element while providing structural integrity. A conductive layer is also integrated beneath the sensing chip, ensuring connectivity between the conductive pads of both chips.

Career Highlights

Hsin Kuan is currently employed at Xintec Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in enhancing the efficiency and functionality of chip packages, making significant contributions to the industry.

Collaborations

Hsin Kuan collaborates with talented individuals such as Chia-Ming Cheng and Chin-Ching Huang, who contribute to the innovative projects at Xintec Corporation.

Conclusion

Hsin Kuan's work in chip packaging technology exemplifies the spirit of innovation and advancement in the semiconductor industry. His patents reflect a deep understanding of the complexities involved in chip design and manufacturing, positioning him as a key figure in this field.