Company Filing History:
Years Active: 2020-2023
Title: Hsin-Hui Chou: Innovator in Chemical Mechanical Polishing Technology
Introduction
Hsin-Hui Chou is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in chemical mechanical polishing technology. With a total of 3 patents to his name, Chou's work has advanced the efficiency and effectiveness of wafer processing.
Latest Patents
Chou's latest patents include innovative systems and methods that enhance the chemical mechanical polishing process. One of his notable inventions is a system for monitoring chemical mechanical polishing. This apparatus features a process chamber with a rotatable platen, a polishing pad, and a wafer carrier. It is equipped with a slurry supply port and a set of microphones that detect sound during operation. The system processes the detected sound to identify events and initiates actions based on feedback signals.
Another significant patent is an inspection and cleaning system designed for wafers. This system includes an inspection device that scans wafers to generate inspected images. An image processing unit analyzes these images using deep learning algorithms to identify defects. If defects are found, the inspection device magnifies the region of interest for better identification.
Career Highlights
Hsin-Hui Chou is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in developing advanced technologies that improve wafer processing and quality control.
Collaborations
Chou collaborates with talented professionals in his field, including Tien-Wen Wang and In-Tsang Lin. Their combined expertise contributes to the innovative solutions developed at their company.
Conclusion
Hsin-Hui Chou's contributions to chemical mechanical polishing technology have made a significant impact on the semiconductor industry. His innovative patents and collaborative efforts continue to drive advancements in wafer processing.