Hsin-Hsie Lee

Title: Hsin-Hsie Lee: Innovator in Semiconductor Technology

Introduction

Hsin-Hsie Lee is a prominent inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Hsin-Hsie Lee holds a patent for a substrate, semiconductor construction, and manufacturing method thereof. This patent describes a substrate that includes a die-bonding zone and a glue spreading pattern. The die-bonding zone is specifically designed to bond a die. The glue spreading pattern is situated within the die-bonding zone and features a containing space. The die is positioned on the glue spreading pattern, where the area of the die's bottom is greater than the area of the glue spreading pattern's opening. The containing room of the glue spreading pattern is filled with glue, allowing the die to be bonded to the substrate through this adhesive.

Career Highlights

Hsin-Hsie Lee is associated with Unistars Corporation, where he continues to advance his work in semiconductor technologies. His innovative approach has positioned him as a key figure in the industry.

Collaborations

Hsin-Hsie Lee has collaborated with notable colleagues, including Tien-hao Huang and Yi-chun Wu. Their combined expertise contributes to the ongoing development of cutting-edge technologies in their field.

Conclusion

Hsin-Hsie Lee's contributions to semiconductor technology through his patent and work at Unistars Corporation highlight his role as an influential inventor. His innovative methods continue to shape the future of the industry.